SMAJ5.0A 力特現貨
SMAJ5.0A 力特現貨，2022年新貨，需要產品的可以出貨，量大價優！
Description
Features
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter Symbol Value Unit
Peak Pulse Power Dissipation at TA=25°
by 10/1000us Waveform(Fig.2)(Note 1),
(Note 2) -Single Die Parts
PPPM 400 W
Peak Pulse Power Dissipation at TA=25°
by 10/1000us Waveform(Fig.2)(Note 1),
(Note 2)-Stacked Die Parts(Note 5)
PPPM 600 W
Power Dissipation on Infinite Heat Sink
at TL
=50OC PD 3.3 W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3) I
FSM 60 A
Maximum Instantaneous Forward
Voltage at 25A for Unidirectional Only
(Note 4)
VF 3.5/5.0 V
Operating Temperature Range TJ -65 to 150 °C
Storage Temperature Range TSTG -65 to 175 °C
Typical Thermal Resistance Junction to
Lead RθJL 30 °C/W
Typical Thermal Resistance Junction to
Ambient RθJA 120 °C/W
The SMAJ series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by lightning
and other transient voltage events.
Applications
TVS devices are ideal for the protection of I/O Interfaces, VCC bus
and other vulnerable circuits used in Telecom, Computer, Industrial
and Consumer electronic applications.
■ 400W Peak Pulse Power
capability at 10/1000μs
waveform, repetition rate
(duty cycle): 0.01%
■ Excellent clamping capability
■ Typical IR less than 1μA when
VBR min>12V
■ Surface mount footprint for
compact PCB layout
■ Low profile package
■ Typical failure mode is short
from over-specified voltage or
current
■ Whisker test is conducted
based on JEDEC JESD201A
per its table 4a and 4c
■ IEC-61000-4-2 ESD 30kV(Air),
30kV (Contact)
■ ESD protection of data lines
in accordance with IEC
61000-4-2
■ EFT protection of data lines in
accordance with IEC 61000-
4-4
■ Built-in strain relief
■ Fast response time: typically
less than 1.0ps from 0 Volts
to VBR min
■ Glass passivated junction
■ Low inductance
■ High temperature to reflow
soldering guaranteed:
260°C/30sec
■ VBR @ TJ= VBR@25°C
x (1+αT x (TJ - 25))
(αT:Temperature
Coefficient, typical value is
0.1%)
■ Plastic package is
flammability rated V-0 per
UL-94.
■ Meet MSL level1, per
J-STD-020, LF maximun peak
of 260°C
■ Matte tin, lead–free plated
■ Halogen free and RoHS
compliant
■ Pb-free E3 means 2nd level
interconnect is Pb-free and
the terminal finish material is
tin(Sn) (IPC/JEDEC J-STD609A.01)
Uni-directional Bi-directional
Functional Diagra
功能與特色:
- 無鹵素，且符合RoHS標準
- 表面封裝可優化面板空間
- 小尺寸封裝
- 內置式應力消除
- 玻璃鈍化結
- 低電感
- 出色的箝位能力
- 重復頻率（工作循環）: 0.01%
- 快速的響應時間: 從0伏特至VBR的單向最小值通常小于1.0ps
- 電壓高于10V時，標準IR小于1mA
- 高溫焊接: 接線端250°C./10秒
- 塑料封裝已獲UL易燃性分級94V-O認證
